높은 열 사이클링 성능 BT145-800R TO-220 SCR
$0.135000-19999 Piece/Pieces
$20000≥20000Piece/Pieces
지불 유형: | L/C,T/T,Paypal |
인 코텀: | FOB,CFR,CIF |
수송: | Ocean,Express,Others |
포트: | SHANGHAI |
$0.135000-19999 Piece/Pieces
$20000≥20000Piece/Pieces
지불 유형: | L/C,T/T,Paypal |
인 코텀: | FOB,CFR,CIF |
수송: | Ocean,Express,Others |
포트: | SHANGHAI |
모형: YZPST-BT145-800R
상표: yzpst
Place Of Origin: China
VRRM: 800V
IT(RMS): 25A
ITSM: 300A
I2t: 450A2s
D IT/dt: 200A/μs
IGM: 5A
VRGM: 5V
PGM: 20W
높은 접합부 작동 온도 기능 (TJ (max) = 150 ° C)
빠른 참조 데이터
Symbol | Parameter | Conditions | Min | Typ | Max | Unit | |
Absolute maximum rating | |||||||
VRRM | repetitive peak reverse voltage | - | - | 800 | V | ||
IT(RMS) | RMS on-state current | half sine wave; Tmb ≤ 128 °C; | - | - | 25 | A | |
Fig. 1; Fig. 2; Fig. 3 | |||||||
ITSM | non-repetitive peak on- state current | half sine wave; Tj(init) = 25 °C; tp = 10 ms; Fig. 4; Fig. 5 | - | - | 300 | A | |
half sine wave; Tj(init) = 25 °C; tp = 8.3 ms | - | - | 330 | A | |||
Tj | junction temperature | - | - | 150 | °C | ||
Symbol | Parameter | Conditions | Min | Typ | Max | Unit | |
Static characteristics | |||||||
IGT | gate trigger current | VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 7 | 1.5 | - | 15 | mA | |
IH | holding current | VD = 12 V; Tj = 25 °C; Fig. 9 | - | - | 60 | mA | |
VT | on-state voltage | IT = 30 A; Tj = 25 °C; Fig. 10 | - | 1.1 | 1.5 | V | |
Dynamic characteristics | |||||||
dVD/dt | rate of rise of off-state voltage | VDM = 536 V; Tj = 150 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit | 80 | - | - | V/μs |
값 제한
i n 일치 ~와 함께 그만큼 순수한 최고 평가 체계 ( IEC 60134).
Symbol | Parameter | Conditions | Min | Max | Unit | |
VDRM | repetitive peak off-state voltage | - | 800 | V | ||
VRRM | repetitive peak reverse voltage | - | 800 | V | ||
IT(AV) | average on-state current | half sine wave; Tmb ≤ 128°C; | - | 16 | A | |
IT(RMS) | RMS on-state current | half sine wave; Tmb ≤ 128°C; Fig. 1; Fig. 2; Fig. 3 | - | 25 | A |
ITSM | non-repetitive peak on- state current | half sine wave; Tj(init) = 25 °C; tp = 10 ms; Fig. 4; Fig. 5 | - | 300 | A | |
half sine wave; Tj(init) = 25 °C; tp = 8.3 ms | - | 330 | A | |||
I2t | I2t for fusing | tp = 10 ms; SIN | - | 450 | A2s | |
d IT/dt | rate of rise of on-state current | IG = 20 mA | - | 200 | A/μs | |
IGM | peak gate current | - | 5 | A | ||
VRGM | peak reverse gate | - | 5 | V | ||
voltage | ||||||
PGM | peak gate power | - | 20 | W | ||
PG(AV) | average gate power | over any 20 ms period | - | 0.5 | W | |
Tstg | storage temperature | -40 | 150 | °C | ||
Tj | junction temperature | - | 150 | °C |
열 특성
Symbol | Parameter | Conditions | Min | Typ | Max | Unit | |
Rth(j-mb) | thermal resistance | Fig. 6 | - | - | 1 | K/W | |
from junction to | |||||||
mounting base | |||||||
Rth(j-a) | thermal resistance | in free air | - | 60 | - | K/W | |
from junction to | |||||||
ambient free air |
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